华进半导体主办的“华进开放日”活动已成功举办了四届，曾邀请到了无锡市政府、中国工程院院士、中科院外籍院士、02专项总师、江苏省产业技术研究院、无锡科技局、国家封测联盟、新区科技局等领导到会演讲与发言，在行业内得到了一致的欢迎与肯定。

2016年是国家“十三五”规划实施的第一年，集成电路产业作为规划中的战略性新型产业将迎来发展的关键期，创新、开放、绿色、融合将是IC产业的发展方向，而集成电路封装测试是产业链的重要环节，也将迎来重大发展机遇。《国家集成电路产业发展推进纲要》中，明确提出“提升先进封装测试业发展水平。大力推动国内封装测试企业兼并重组，提高产业集中度。适应集成电路设计与制造工艺节点的演进升级需求，开展芯片级封装（CSP）、圆片级封装（WLP）、硅通孔（TSV）、三维封装等先进封装和测试技术的开发及产业化”。在此背景下，现定于2016年11月10日--11日召开第五届“华进开放日”暨先进半导体封装技术研讨会。

会议将邀请政府领导及国内外知名学者到会演讲，从产业政策、系统需求、封装工艺、设备与材料等向与会人员展示新一代封装的技术前景。

会议时间：

2016年11月10日--11月11日

会议地点：

无锡新湖铂尔曼大酒店3楼翡翠厅（新吴区和风路30号）

指导单位：

新吴区人民政府

江苏省产业技术研究院

无锡市科技局

国家IC封测产业链技术创新战略联盟

承办单位：

华进半导体封装先导技术研发中心有限公司（半导体封装技术研究所）

江苏省半导体行业协会

支持单位：

SEMI

中国半导体行业协会集成电路分会

江苏省IC产业链技术创新战略联盟

无锡市半导体行业协会

会议议程：

 2016年11月10日（星期四）8:45-18:00

2016年11月11日（星期五）8:45-17:00

华进联系人：

刘海燕   0510-6667 1516、1893607 1918、haiyanliu@ncap-cn.com

许  超   0510-6667 0816、136 6510 0100、

chaoxu@ncap-cn.com

联盟联系人：

张琼月   159 50418867

陈浩鹏   134 86177790

联盟邮箱 cjssia@yeah.net

住宿（需自理）：

无锡新湖铂尔曼大酒店（新吴区和风路30号）

（会议协议价400元/天，含早餐2份，自行预定时需报华进公司名字）

酒店联系人：史经理   1805195 1868

参会报名：

联盟、联合体、协会会员免费参加；非联盟、联合体和协会会员，报名费500元/位。

参会回执：

下载“参会回执表”

演讲嘉宾介绍

张原

EducationBackground:

1996.9~1999.4   Graduate Institute of BUAA (Beijing Universityof Aeronautics and Austronautics), and got Master degree of Material Science

1992.9~1996.7 Material Department of BUAA, and got bachelor’s degree of Metal

Work Introduction:

ZhangYuan joined HUAWEI technologies Co.LTD in 1999 and focused on developingelectronic engineering for 17 years.

2011-now，I work in Board Engineering TechnologyStrategy and Plan department for sourcing new copartner and supporting the newproject development，especially for passive opticalinterconnection.

2010-2011,I also responsible for SIP package process

2008-2011, I became optical electrical process technical manager and give technologyassurance for optical electrical modules and subassembly.

2005~2007,I have been assembly material technical manager and give technology assurancefor electrical material suppliers.

During2000 to 2006,I served as the first PCB technical manager ,devoting my effort tosourcing PCB suppliers and developing new technologies with them together.

JamesE. Morris

Jim is a ProfessorEmeritus of Electrical & Computer Engineering at Portland State University,Oregon, and at the State University of New York at Binghamton.  His B.Sc.and 1st Class Honors M.Sc. degrees in Physics are from the University of Auckland,New Zealand, and his Ph.D. in Electrical Engineering is from the University ofSaskatchewan, Canada.  He has served as Department Chair at bothBinghamton and Portland, and was the founding Director of Binghamton’s Institute for Research in Electronics Packaging. Jimhas also held faculty positions at Saskatchewan, Victoria University ofWellington (NZ), and South Dakota School of Mines & Technology, withvisiting/sabbatical positions at Loughborough University (UK) as a RoyalAcademy of Engineering Distinguished Visiting Fellow, Chemnitz University ofTechnology (Germany), University of Maryland (USA), University of Bordeaux(France), University of Greenwich (London), Chalmers University of Technology(Sweden), Dresden University of Technology, University of Canterbury (NZ) as anErskine Fellow, and Helsinki University of Technology as a Nokia-FulbrightFellow, with honorary appointments at Shanghai University and Shanghai JiaoTong University. Other positions have included Senior Technician and Post-DoctoralFellow at the U of S, brief periods with Delphi Engineering (NZ) andIBM-Endicott (New York), and industrial consulting. He was recognized in 2015with an honorary doctorate from the POLITEHNICA University of Bucharest.

Jim is an IEEE LifeFellow and a Distinguished Lecturer for both the IEEE Nanotechnology Council(NTC) and the IEEE Components, Packaging, & Manufacturing (CPMT) Society.He has served as CPMT Treasurer (1991-1997) and Vice-President for Conferences(1998-2003), and currently sits on the CPMT Board of Governors (1996-1998,2011-2016) and on the joint Oregon CAS/CPMT Chapter executive committee, andchairs the CPMT Nanotechnology technical committee. He was awarded the IEEEMillennium Medal and won the CPMT David Feldman Outstanding Contribution Awardin 2005. He is an Associate-Editor of the IEEE CPMT Transactions and has beenGeneral Chair of three CPMT-sponsored conferences, Treasurer or Technical Chairof others, and serves on several CPMT conference committees. As the CPMTSociety representative on the NTC, he instituted a regular Nanopackaging seriesof articles in the IEEE Nanotechnology Magazine, established the NTCNanopackaging technical committee, (which also acts as a program committee forannual IEEE NANO conferences,) served as the 2010-2012 NTC Awards Chair,chaired the IEEE NANO 2011 conference in Portland, and served as NTCVice-President for Conferences (2013-2014) and currently as Vice-President forFinance (2015-2018.) He also co-founded the Oregon Chapter of the IEEE EducationSociety in 2005 and sits on its executive committee, and was Program Chair forthe 1st and 2nd IEEE Conferences on Technology forSustainability (2013/14). 

His researchactivities are focused on electrically conductive adhesives, the electrical conductionmechanisms in discontinuous nanoparticle thin metal films, with applications tonanopackaging and single-electron transistor nanoelectronics, and on anNSF-funded project in undergraduate nanotechnology education. He has edited orco-authored five books on electronics packaging and two on nanodevices, andlectures internationally on nanopackaging and electrically conductiveadhesives. He is currently putting together the expanded second edition of hisbook: “Nanopackaging:Nanotechnologies and Electronics packaging” (Springer,2017.).

RichardRAO

Dr. RichardRAO is currently a Technical Fellow of Microsemi Corp, a lead supplier ofhigh reliability integrate circuit, located in southern California, USA and anelected Senior Member of IEEE.  He managesthe corporate reliability program and his main focus is to develop design forreliability flows for advanced circuits, packaging and chip to packageinteraction. He has a Ph.D. degree in solid mechanics of materials from theUniversity of Science and Technology of China. Prior to joining Microsemi in2004, Dr. Raoheld various academic and technical positions in reliabilityphysics and engineering. He was an associate professor at University of Scienceand Technology of China, a research fellow at Northwestern University,Evanston, IL, USA and National Science and Technology Board of Singapore. Healso held senior and principal engineering positions in Motorola Electronicsand Ericsson Inc. He has published over 30 papers on reliability physics andapplications and also a main contributor of several JEDEC standards. He servesas the technical committee member for ECTC (Electronics Component andTechnology Conference) and IRPS (International Reliability and PhysicsSymposium). He is a speaker to IRPS, ECTC, ISQED (International Symposium onQuality Electronics Design), ASME Symposiums and a keynote speaker to ICEPT andInternational Conference on System on Chip, etc.

Dr. Rao has over 20years’ hands on experienceand knowledge in the advanced packaging technologies such as big size FCBGA,TSV based 2.5D and non-TSV based 2.5D packages; advanced wafer processes suchas 28nm HKMG and 16nm FF, advanced IC and optical packaging, chip to packageinteraction, board and system level reliability physics and applications. Hehas conducted professional development courses on advanced IC reliability toboth industrial and academic worlds.

AndrewTay

博士，新加坡国立大学机械工程系教授。获澳大利亚新南威尔士州大学教育学硕士学位(一级荣誉大学奖章)和机械工程博士学位。主要研究领域包括：IC封装的热机械失效、热管理、圆片级封装,焊点可靠性和MEMS(微机电系统)。曾担任过ASME（美国机械工程师协会）《电子封装》杂志的副主编，《微电子学》杂志和《有限元分析和设计》杂志编辑部成员。1997年-1998年，担任新加坡IEEE第一二届电子封装技术会议大会执行主席。世界40多家知名公司和组织聘请ANDREW TAY博士为顾问，如新加坡港务局港，远东Levingston造船有限公司，加德士（亚洲）有限公司，索尼精密工程中心，惠普（新加坡），德州仪器（新加坡），德尔福汽车系统新加坡私人有限公司等。他一直服务于几个国际封装会议的国际顾问委员会和组织委员会，如ECTC, Inter Pack, EPTC, ITHERM等。因为其突出的成就和贡献，在2000年被授予IEEE第三千禧年奖章。由于其在机械工程、电子/光电子封装应用领域的突出贡献获得了2004年ASME EPPD机械工程奖，2012年，因ANDREW TAY博士的卓越的领导才能和特别贡献，获得CPMT10（亚太）地区贡献奖。同时他也是ASME成员和新加坡工程师学会的院士。申请3项美国专利，主持或参与完成专著3部在国际核心期刊上发表期刊论文52余篇，会议论文152余篇。

（来源：华进半导体）